Ceramic products in the 5G field

With the official opening of 5G commercialization in China, 5G has become a key infrastructure for the transformation of the digital economy and is gradually gaining popularity and penetrating into all areas of society. 5G industry chain is very broad, including components, major equipment, operators and downstream applications. Initial investments mainly include wireless equipment, transmission equipment, base station equipment, small base stations, optical communication equipment, and network planning and implementation. In terms of application direction, 5G applications include three major directions: industrial digitization, smart life, and digital governance.

Traditional ceramics and advanced ceramics are not clear? A comprehensive understanding of advanced ceramics together

Traditional ceramics, also called general ceramics, can be divided into daily-use ceramics, art ceramics, architectural and sanitary ceramics, etc. by application.

Ceramic meets metallization

Ceramics, often referred to as inorganic non-metallic materials, can be seen to be positioned directly on the opposite side of metals - after all, their properties are very different. But their respective advantages are so outstanding that in many cases it is necessary to combine ceramics and metals to show their respective advantages, thus giving birth to a very important technology - ceramic metallization technology. For many years, ceramic metallization has been a hot topic, and scholars at home and abroad have conducted in-depth research on it. Especially with the advent of the 5G era, the power of semiconductor chips is increasing, the development trend of light weight and high integration is becoming more and more obvious, and the importance of heat dissipation is becoming more and more prominent, which undoubtedly puts forward more stringent requirements for packaging heat dissipation materials. In the package structure of power electronic components, the package substrate serves as a key link to carry the top and bottom and keep the internal and external circuits conductive, with the functions of heat dissipation and mechanical support. As a new type of electronic heat dissipation packaging material, ceramic has high thermal conductivity, insulation, heat resistance, strength and thermal expansion coefficient matched with the chip, making it an ideal packaging material for power electronic components.

HTCC and LTCC, can you tell the difference?

With the rise and application of power devices, especially the third generation semiconductor devices, semiconductor devices are gradually developing in the direction of high power, miniaturization, integration and multi-function, which also puts forward higher requirements on the performance of packaging substrates. Ceramic substrates are widely used in the packaging of electronic devices because of their high thermal conductivity, good heat resistance, low coefficient of thermal expansion, high mechanical strength, good insulation, corrosion resistance, and radiation resistance.

Strategic thinking on the development of electronic ceramic technology in China

Electronic ceramics is the core material of passive electronic components, and is an important material basis for electronic information technology. In recent years, with the integration, thinness, intelligence and miniaturization of electronic information technology, active devices and integrated circuits based on semiconductor technology are developing rapidly, while passive electronic components are increasingly becoming a bottleneck in the development of electronic component technology. Therefore, electronic ceramic materials and their preparation and processing technology increasingly become one of the important core technologies that restrict the development of electronic information technology. China is a large country with passive electronic components. From the point of view of product output, the production of passive components accounted for more than 40% of the world; but not a strong country, the parts output value is less than a quarter of the global output value, high-end components rely heavily on imports. Electronic ceramic materials and technology is one of the important factors limiting the development of high-end components. From a strategic point of view, it is important to study the development status of electronic ceramic materials and components technology at home and abroad, and analyze the problems and countermeasures in related fields in China.

【New Technology】Tower type friction disc false twister

Our company's original research and development, has declared the invention patent tower friction disc false twister, service items: you propose spinning specifications, we prepare the whole machine friction disc