Advanced Ceramics Industry Research

Broadly speaking, ceramic materials refer to all materials other than organic and metallic materials, i.e. inorganic non-metallic materials. They are mainly divided into conventional ceramic materials and advanced ceramic materials.

What are the toughening methods for alumina ceramics?

The structure of alumina ceramic materials is corundum type, which has its own ionic bonding characteristics, making the slip system much less than that of metals, which leads to a certain lack of toughness and plasticity. Therefore, it exhibits low fracture toughness, which greatly limits the widespread use of alumina ceramics.

Ceramic products in the 5G field

With the official opening of 5G commercialization in China, 5G has become a key infrastructure for the transformation of the digital economy and is gradually gaining popularity and penetrating into all areas of society. 5G industry chain is very broad, including components, major equipment, operators and downstream applications. Initial investments mainly include wireless equipment, transmission equipment, base station equipment, small base stations, optical communication equipment, and network planning and implementation. In terms of application direction, 5G applications include three major directions: industrial digitization, smart life, and digital governance.

Traditional ceramics and advanced ceramics are not clear? A comprehensive understanding of advanced ceramics together

Traditional ceramics, also called general ceramics, can be divided into daily-use ceramics, art ceramics, architectural and sanitary ceramics, etc. by application.

Ceramic meets metallization

Ceramics, often referred to as inorganic non-metallic materials, can be seen to be positioned directly on the opposite side of metals - after all, their properties are very different. But their respective advantages are so outstanding that in many cases it is necessary to combine ceramics and metals to show their respective advantages, thus giving birth to a very important technology - ceramic metallization technology. For many years, ceramic metallization has been a hot topic, and scholars at home and abroad have conducted in-depth research on it. Especially with the advent of the 5G era, the power of semiconductor chips is increasing, the development trend of light weight and high integration is becoming more and more obvious, and the importance of heat dissipation is becoming more and more prominent, which undoubtedly puts forward more stringent requirements for packaging heat dissipation materials. In the package structure of power electronic components, the package substrate serves as a key link to carry the top and bottom and keep the internal and external circuits conductive, with the functions of heat dissipation and mechanical support. As a new type of electronic heat dissipation packaging material, ceramic has high thermal conductivity, insulation, heat resistance, strength and thermal expansion coefficient matched with the chip, making it an ideal packaging material for power electronic components.

HTCC and LTCC, can you tell the difference?

With the rise and application of power devices, especially the third generation semiconductor devices, semiconductor devices are gradually developing in the direction of high power, miniaturization, integration and multi-function, which also puts forward higher requirements on the performance of packaging substrates. Ceramic substrates are widely used in the packaging of electronic devices because of their high thermal conductivity, good heat resistance, low coefficient of thermal expansion, high mechanical strength, good insulation, corrosion resistance, and radiation resistance.